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BSC090N03MS G
OptiMOSTM3 M-Series Power-MOSFET
Features * Optimized for 5V driver application (Notebook, VGA, POL) * Low FOMSW for High Frequency SMPS * 100% avalanche tested * N-channel * Very low on-resistance R DS(on) @ V GS=4.5 V * Excellent gate charge x R DS(on) product (FOM) * Qualified according to JEDEC1) for target applications * Superior thermal resistance * Pb-free plating; RoHS compliant * Halogen-free according to IEC61249-2-21 Type BSC090N03MS G Package PG-TDSON-8 Marking 090N03MS
Product Summary V DS R DS(on),max V GS=10 V V GS=4.5 V ID 30 9 11.2 48 PG-TDSON-8 A V m
Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID V GS=10 V, T C=25 C V GS=10 V, T C=100 C V GS=4.5 V, T C=25 C V GS=4.5 V, T C=100 C V GS=4.5 V, T A=25 C, R thJA=50 K/W 2) Pulsed drain current3) Avalanche current, single pulse 4) Avalanche energy, single pulse Gate source voltage
1)
Value 48 30 43 27
Unit A
12 192 40 10 20 mJ V
I D,pulse I AS E AS V GS
T C=25 C T C=25 C I D=35 A, R GS=25
J-STD20 and JESD22
Rev. 1.16
page 1
2009-11-03
BSC090N03MS G
Maximum ratings, at T j=25 C, unless otherwise specified Parameter Power dissipation Symbol Conditions P tot T C=25 C T A=25 C, R thJA=50 K/W 2) Operating and storage temperature IEC climatic category; DIN IEC 68-1 T j, T stg Value 32 2.5 -55 ... 150 55/150/56 C Unit W
Parameter
Symbol Conditions min.
Values typ. max.
Unit
Thermal characteristics Thermal resistance, junction - case R thJC bottom top Device on PCB R thJA 6 cm2 cooling area2) 3.9 20 50 K/W
Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=250 A V DS=30 V, V GS=0 V, T j=25 C V DS=30 V, V GS=0 V, T j=125 C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=16 V, V DS=0 V V GS=4.5 V, I D=30 A V GS=10 V, I D=30 A Gate resistance Transconductance
2)
30 1 -
0.1
2 1
V
A
0.5
10 10 9.0 7.5 1 55
100 100 11.2 9.0 1.8 S nA m
RG g fs |V DS|>2|I D|R DS(on)max, I D=30 A
28
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. See figure 3 for more detailed information
3)
Rev. 1.16
page 2
2009-11-03
BSC090N03MS G
Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 5) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total Q gs Q g(th) Q gd Q sw Qg V plateau Qg V DD=15 V, I D=30 A, V GS=0 to 10 V V DS=0.1 V, V GS=0 to 4.5 V V DD=15 V, V GS=0 V V DD=15 V, I D=30 A, V GS=0 to 4.5 V 4.6 2.3 2.1 4.4 8.9 3.2 18 6.1 3.0 3.5 6.5 12 24 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=15 V, V GS=4.5 V, I D=30 A, R G=1.6 V GS=0 V, V DS=15 V, f =1 MHz 1400 470 29 9.0 5.0 8.8 5.4 1900 630 ns pF Values typ. max. Unit
Gate charge total, sync. FET Output charge Reverse Diode Diode continuous forward current Diode pulse current Diode forward voltage
Q g(sync) Q oss
-
7.7 12
10 16
nC
IS I S,pulse V SD
T C=25 C V GS=0 V, I F=30 A, T j=25 C V R=15 V, I F=I S, di F/dt =400 A/s
-
0.9
29 192 1.1
A
V
Reverse recovery charge
4) 5)
Q rr
-
-
10
nC
See figure 13 for more detailed information See figure 16 for gate charge parameter definition
Rev. 1.16
page 3
2009-11-03
BSC090N03MS G
1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C) parameter: V GS
35 60
30
50
25 40
P tot [W]
20
I D [A]
15
30
4.5 V 10 V
20 10 10
5
0 0 40 80 120 160
0 0 40 80 120 160
T C [C]
T C [C]
3 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p
103
4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T
10
limited by on-state resistance
1 s 0.5 10 s
10
2
1
100 s
0.2 0.1 0.05 0.02 0.01 single pulse
101
DC
1 ms
Z thJC [K/W]
0.1
10 ms
I D [A]
100
10-1 10-1 100 101 102
0.01
0
0
0
0
0
0
1
10-6
10-5
10-4
10-3
10-2
10-1
100
V DS [V]
t p [s]
Rev. 1.16
page 4
2009-11-03
BSC090N03MS G
5 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS
100
5V 4.5 V
6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 C parameter: V GS
16
3V 3.2 V
3.5 V
80
10 V
4V
12
4V 4.5 V 5V
R DS(on) [m]
60
I D [A]
8
6V
3.5 V
40
10 V
3.2 V
4
20
3V 2.8 V
0 0 1 2 3
0 0 10 20 30 40 50
V DS [V]
I D [A]
7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j
120
8 Typ. forward transconductance g fs=f(I D); T j=25 C
120
100
100
80
80
60
g fs [S]
150 C 25 C
I D [A]
60
40
40
20
20
0 0 1 2 3 4 5
0 0 40 80 120 160
V GS [V]
I D [A]
Rev. 1.16
page 5
2009-11-03
BSC090N03MS G
9 Drain-source on-state resistance R DS(on)=f(T j); I D=30 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS; I D=250 A
16
2.5
2 12
R DS(on) [m]
98 %
8
typ
V GS(th) [V]
100 140 180
1.5
1
4 0.5
0 -60 -20 20 60
0 -60 -20 20 60 100 140 180
T j [C]
T j [C]
11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz
12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j
104
10000
1000
25 C
150 C, 98%
103
1000
Ciss Coss
100
C [pF]
I F [A]
150 C 25 C, 98%
102
100
10
Crss
101
10
1 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0
0
V DS [V]
V SD [V]
Rev. 1.16
page 6
2009-11-03
BSC090N03MS G
13 Avalanche characteristics I AS=f(t AV); R GS=25 parameter: T j(start)
100
14 Typ. gate charge V GS=f(Q gate); I D=30 A pulsed parameter: V DD
12
15 V
10
6V
24 V
8
10
100 C
25 C
V GS [V]
1000
I AV [A]
6
125 C
4
2
1 1 10 100
0 0 5 10 15 20
t AV [s]
Q gate [nC]
15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA
16 Gate charge waveforms
34
V GS
32
Qg
30
V BR(DSS) [V]
28
26
V g s(th)
24
22
Q g(th) Q gs
-60 -20 20 60 100 140 180
Q sw Q gd
Q g ate
20
T j [C]
Rev. 1.16
page 7
2009-11-03
BSC090N03MS G
Package Outline PG-TDSON-8
Rev. 1.16
page 8
2009-11-03
BSC090N03MS G
Package Outline PG-TDSON-8: Tape
Dimensions in mm Rev. 1.16 page 9 2009-11-03
BSC090N03MS G
Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Rev. 1.16
page 10
2009-11-03

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